Microelectronics Reliability

Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.

《Microelectronics Reliability》是一本由PERGAMON-ELSEVIER SCIENCE LTD出版商出版的专业工程技术期刊，该刊创刊于1964年，刊期Monthly，该刊已被国际权威数据库SCI、SCIE收录。在中科院最新升级版分区表中，该刊分区信息为大类学科：工程技术 4区，小类学科：工程：电子与电气 4区；纳米科技 4区；物理：应用 4区；在JCR（Journal Citation Reports）分区等级为Q4。该刊发文范围涵盖工程：电子与电气等领域，旨在及时、准确、全面地报道国内外工程：电子与电气工作者在该领域取得的最新研究成果、工作进展及学术动态、技术革新等，促进学术交流，鼓励学术创新。2021年影响因子为1.418，平均审稿速度较快,2-4周。